JH

John D. Hopkins

Micron: 32 patents #6 of 1,553Top 1%
📍 Meridian, ID: #1 of 122 inventorsTop 1%
🗺 Idaho: #1 of 1,264 inventorsTop 1%
Overall (2024): #536 of 561,600Top 1%
44
Patents 2024

Issued Patents 2024

Showing 26–44 of 44 patents

Patent #TitleCo-InventorsDate
11950416 Integrated assemblies and methods of forming integrated assemblies Alyssa N. Scarbrough, Jordan D. Greenlee 2024-04-02
11950415 Integrated assemblies and methods of forming integrated assemblies Alyssa N. Scarbrough, Jordan D. Greenlee 2024-04-02
11948639 Methods including a method of forming a stack and isotropically etching material of the stack Alyssa N. Scarbrough 2024-04-02
11937429 Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorus Justin B. Dorhout, Fei Wang, Chet E. Carter, Ian C. Laboriante, Kunal Shrotri +5 more 2024-03-19
11925016 Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells 2024-03-05
11923415 Integrated assemblies, and methods of forming integrated assemblies Jordan D. Greenlee 2024-03-05
11916024 Semiconductor devices comprising steps Rohit Kothari, Adam L. Olson, Jeslin J. Wu 2024-02-27
11917817 Microelectronic devices, memory devices, and electronic systems Shuangqiang Luo, Lifang Xu, Nancy M. Lomeli, Indra V. Chary, Kar Wui Thong +1 more 2024-02-27
11915974 Integrated circuitry, a memory array comprising strings of memory cells, a method used in forming a conductive via, a method used in forming a memory array comprising strings of memory cells Shuangqiang Luo, Alyssa N. Scarbrough 2024-02-27
11910596 Integrated assemblies and methods of forming integrated assemblies Jordan D. Greenlee, Alyssa N. Scarbrough 2024-02-20
11910606 Integrated assemblies comprising conductive levels having two different metal-containing structures laterally adjacent one another, and methods of forming integrated assemblies Jordan D. Greenlee 2024-02-20
11910601 Microelectronic devices with source region vertically between tiered decks, and related methods and systems Darwin A. Clampitt, Matthew J. King, Roger W. Lindsay, Kevin Y. Titus 2024-02-20
11903211 Methods of forming a microelectronic device including stair step structures Lifang Xu, Roger W. Lindsay, Shuangqiang Luo 2024-02-13
11894305 Microelectronic devices including staircase structures, and related memory devices and electronic systems Jordan D. Greenlee, Rita J. Klein, Everett A. McTeer, Lifang Xu, Daniel Billingsley +1 more 2024-02-06
11895835 Integrated circuitry comprising a memory array comprising strings of memory cells and methods including a method used in forming a memory array comprising strings of memory cells Alyssa N. Scarbrough, Jordan D. Greenlee 2024-02-06
11894269 Integrated assemblies and methods of forming integrated assemblies Lifang Xu, Nancy M. Lomeli 2024-02-06
11889683 Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells Darwin A. Clampitt, Michael J. Puett, Christopher R. Ritchie 2024-01-30
11889696 Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells Nancy M. Lomeli 2024-01-30
11871572 Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies Shyam Surthi, Davide Resnati, Paolo Tessariol, Richard J. Hill 2024-01-09