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Microelectronic devices and memory devices including conductive levels having varying compositions |
Jordan D. Greenlee, John D. Hopkins, Yiping Wang, Rajesh Balachandran, Rita J. Klein +1 more |
2024-12-17 |
| 12114492 |
Memories having vertically stacked conductive filled structures |
Jordan D. Greenlee, John Mark Meldrim |
2024-10-08 |
| 12034057 |
Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material |
Jordan D. Greenlee, Rita J. Klein, John Mark Meldrim |
2024-07-09 |
| 12002759 |
Apparatuses including a conductive contact including a dielectric material surrounded by a conductive material |
Jordan D. Greenlee, Lifang Xu, Rita J. Klein, Xiao Li |
2024-06-04 |
| 11990528 |
Assemblies having conductive structures with three or more different materials |
David Ross Economy, Rita J. Klein, Jordan D. Greenlee, John Mark Meldrim, Brenda D. Kraus |
2024-05-21 |
| 11894305 |
Microelectronic devices including staircase structures, and related memory devices and electronic systems |
Jordan D. Greenlee, John D. Hopkins, Rita J. Klein, Lifang Xu, Daniel Billingsley +1 more |
2024-02-06 |