Issued Patents 2024
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185544 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | John D. Hopkins, Shyam Surthi | 2024-12-31 |
| 12171101 | Microelectronic devices including conductive structures | Daniel Billingsley, Matthew J. King, Yongjun Jeff Hu, Tom George, Amritesh Rai +2 more | 2024-12-17 |
| 12170250 | Microelectronic devices and memory devices including conductive levels having varying compositions | John D. Hopkins, Everett A. McTeer, Yiping Wang, Rajesh Balachandran, Rita J. Klein +1 more | 2024-12-17 |
| 12159674 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | John D. Hopkins, M. Jared Barclay, Andrew Li, Aireus Christensen | 2024-12-03 |
| 12144176 | Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assemblies | John D. Hopkins, Purnima Narayanan | 2024-11-12 |
| 12113019 | Memory devices including strings of memory cells, and related electronic systems | John D. Hopkins, Marko Milojevic | 2024-10-08 |
| 12114492 | Memories having vertically stacked conductive filled structures | John Mark Meldrim, Everett A. McTeer | 2024-10-08 |
| 12096633 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Daniel Billingsley, Indra V. Chary, Rita J. Klein | 2024-09-17 |
| 12082409 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | John D. Hopkins | 2024-09-03 |
| 12063782 | Integrated assemblies having metal-containing liners along bottoms of trenches, and methods of forming integrated assemblies | John D. Hopkins, Justin D. Shepherdson, Collin Howder | 2024-08-13 |
| 12058861 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | John D. Hopkins | 2024-08-06 |
| 12041769 | Methods of forming microelectronic devices | John D. Hopkins, Nancy M. Lomeli | 2024-07-16 |
| 12034057 | Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material | Rita J. Klein, Everett A. McTeer, John Mark Meldrim | 2024-07-09 |
| 12002759 | Apparatuses including a conductive contact including a dielectric material surrounded by a conductive material | Lifang Xu, Rita J. Klein, Xiao Li, Everett A. McTeer | 2024-06-04 |
| 11996151 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | John D. Hopkins, Andrew Li, Alyssa N. Scarbrough | 2024-05-28 |
| 11990528 | Assemblies having conductive structures with three or more different materials | David Ross Economy, Rita J. Klein, John Mark Meldrim, Brenda D. Kraus, Everett A. McTeer | 2024-05-21 |
| 11974429 | Method used in forming a memory array comprising strings of memory cells and using bridges in sacrificial material in a tier | John D. Hopkins, Nancy M. Lomeli, Alyssa N. Scarbrough | 2024-04-30 |
| 11972978 | Conductive via of integrated circuitry, memory array comprising strings of memory cells, method of forming a conductive via of integrated circuitry, and method of forming a memory array comprising strings of memory cells | Yiping Wang, Collin Howder | 2024-04-30 |
| 11963359 | Integrated assemblies, and methods of forming integrated assemblies | John D. Hopkins | 2024-04-16 |
| 11950415 | Integrated assemblies and methods of forming integrated assemblies | Alyssa N. Scarbrough, John D. Hopkins | 2024-04-02 |
| 11950416 | Integrated assemblies and methods of forming integrated assemblies | Alyssa N. Scarbrough, John D. Hopkins | 2024-04-02 |
| 11923415 | Integrated assemblies, and methods of forming integrated assemblies | John D. Hopkins | 2024-03-05 |
| 11910606 | Integrated assemblies comprising conductive levels having two different metal-containing structures laterally adjacent one another, and methods of forming integrated assemblies | John D. Hopkins | 2024-02-20 |
| 11910596 | Integrated assemblies and methods of forming integrated assemblies | Alyssa N. Scarbrough, John D. Hopkins | 2024-02-20 |
| 11895834 | Methods used in forming a memory array comprising strings of memory cells | Jiewei Chen, Mithun Kumar Ramasahayam, Nancy M. Lomeli | 2024-02-06 |