JD

Justin B. Dorhout

Micron: 6 patents #175 of 1,553Top 15%
📍 Boise, ID: #41 of 684 inventorsTop 6%
🗺 Idaho: #46 of 1,264 inventorsTop 4%
Overall (2024): #9,335 of 561,600Top 2%
10
Patents 2024

Issued Patents 2024

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
12185546 Microelectronic devices and related memory devices Shuangqiang Luo, Indra V. Chary 2024-12-31
12185537 Integrated structures David Daycock, Kunal R. Parekh, Martin C. Roberts, Yushi Hu 2024-12-31
12029032 Integrated assemblies and methods of forming integrated assemblies Kunal R. Parekh, Martin C. Roberts, Mohd Kamran Akhtar, Chet E. Carter, David Daycock 2024-07-02
12029039 Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material Guangyu Huang, Haitao Liu, Chandra Mouli, Sanh D. Tang, Akira Goda 2024-07-02
12010850 Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies John D. Hopkins, Nirup Bandaru, Damir Fazil, Nancy M. Lomeli, Jivaan Kishore Jhothiraman +1 more 2024-06-11
11985823 Microelectronic devices with slit structures including metal plugs and related systems Shuangqiang Luo, Indra V. Chary 2024-05-14
11937429 Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorus Fei Wang, Chet E. Carter, Ian C. Laboriante, John D. Hopkins, Kunal Shrotri +5 more 2024-03-19
11910598 Microelectronic devices including support pillar structures, and related memory devices Shuangqiang Luo, Indra V. Chary 2024-02-20
11889695 Device, a method used in forming a circuit structure, a method used in forming an array of elevationally-extending transistors and a circuit structure adjacent thereto Paolo Tessariol, Indra V. Chary, Jun Fang, Matthew Park, Zhiqiang Xie +4 more 2024-01-30
11864387 Memory arrays and methods used in forming a memory array comprising strings of memory cells Lifang Xu, Indra V. Chary, Jian Li, Haitao Liu, Paolo Tessariol 2024-01-02