HL

Haitao Liu

Micron: 20 patents #25 of 1,553Top 2%
WT Wuhan Institute Of Technology: 2 patents #1 of 13Top 8%
SL State Grid Jibei Electric Power Company Limited: 2 patents #1 of 11Top 10%
Huawei: 1 patents #1,651 of 4,704Top 40%
TU Tsinghua University: 1 patents #105 of 442Top 25%
Ericsson: 1 patents #743 of 1,554Top 50%
BU Beihang University: 1 patents #26 of 173Top 20%
📍 Boise, ID: #2 of 684 inventorsTop 1%
🗺 Idaho: #3 of 1,264 inventorsTop 1%
Overall (2024): #995 of 561,600Top 1%
32
Patents 2024

Issued Patents 2024

Showing 26–32 of 32 patents

Patent #TitleCo-InventorsDate
11912623 Fluidized solidified soil based on gold tailings, and preparation method thereof Zunqun Xiao, Caiyun Xu, Fuqi WANG, Jian LIN, Hui Wang +7 more 2024-02-27
11905221 Dispersant for premixed fluidized solidified soil, preparation method and application thereof Zunqun Xiao, Caiyun Xu, Hui Wang, Fuqi WANG, Zhentao Lv +7 more 2024-02-20
11910597 Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies Kamal M. Karda, Durai Vishak Nirmal Ramaswamy, Yunfei Gao, Sanh D. Tang, Deepak Chandra Pandey 2024-02-20
11908948 Memory devices including indium-containing materials, and related electronic systems Kamal M. Karda, Guangyu Huang, Akira Goda 2024-02-20
11881917 Communications method and apparatus Yifan Xue, Li Shen, Jian Wang, Da Wang 2024-01-23
11871589 Memory device having 2-transistor memory cell and access line plate Kamal M. Karda, Karthik Sarpatwari, Durai Vishak Nirmal Ramaswamy 2024-01-09
11864387 Memory arrays and methods used in forming a memory array comprising strings of memory cells Lifang Xu, Indra V. Chary, Justin B. Dorhout, Jian Li, Paolo Tessariol 2024-01-02