Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901322 | Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die | Jin Won Jeong, Byeung Soo SONG | 2024-02-13 |
| 11887892 | Method for forming semiconductor die with die region and seal-ring region | Jin Won Jeong, Jang-Hee Lee, Young Hun JUN, Jong-woon LEE | 2024-01-30 |