Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901322 | Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die | Jin Won Jeong, Jae Sik Choi | 2024-02-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901322 | Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die | Jin Won Jeong, Jae Sik Choi | 2024-02-13 |