Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887892 | Method for forming semiconductor die with die region and seal-ring region | Jin Won Jeong, Jang-Hee Lee, Jong-woon LEE, Jae Sik Choi | 2024-01-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887892 | Method for forming semiconductor die with die region and seal-ring region | Jin Won Jeong, Jang-Hee Lee, Jong-woon LEE, Jae Sik Choi | 2024-01-30 |