Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12065595 | Adhesive sheet for temporary attachment and method for producing semiconductor device using the same | Sera Kim, Ji Ho HAN, Mi JANG | 2024-08-20 |
| 12024654 | Non-conductive film and manufacturing method of semiconductor laminate | Eun Yeong KIM, You-Jin Kyung, Ji Ho HAN, Bora YEON, Mi JANG | 2024-07-02 |
| 12006308 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same | Youngsam KIM, Junghak Kim, Ju Hyeon KIM | 2024-06-11 |
| 11993731 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same | Junghak Kim, You-Jin Kyung, Minsu Jeong, Ju Hyeon KIM, Youngsam KIM | 2024-05-28 |
| 11939494 | Resin composition for bonding semiconductor and adhesive film for semiconductor using the same | Jong Min Jang, Byoung Ju Choi, Yu Sun | 2024-03-26 |
| 11932784 | Adhesive composition for dicing tape and dicing tape comprising the same | Da Ae KIM, Ji Ho HAN, Eun Yeong KIM, Mi JANG | 2024-03-19 |
| 11879075 | Resin composition for bonding semiconductors, adhesive film for semiconductor using the same, dicing die bonding film, and method for dicing semiconductor wafer | Wanjung Kim, Jong Min Jang, Byung Ju Choi | 2024-01-23 |