Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11993731 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same | Junghak Kim, You-Jin Kyung, Kwang Joo Lee, Ju Hyeon KIM, Youngsam KIM | 2024-05-28 |