Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12006308 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same | Junghak Kim, Ju Hyeon KIM, Kwang Joo Lee | 2024-06-11 |
| 11993731 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same | Junghak Kim, You-Jin Kyung, Kwang Joo Lee, Minsu Jeong, Ju Hyeon KIM | 2024-05-28 |