Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11939494 | Resin composition for bonding semiconductor and adhesive film for semiconductor using the same | Jong Min Jang, Kwang Joo Lee, Yu Sun | 2024-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11939494 | Resin composition for bonding semiconductor and adhesive film for semiconductor using the same | Jong Min Jang, Kwang Joo Lee, Yu Sun | 2024-03-26 |