Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157945 | Thermal atomic layer deposition of silicon-containing films | Awnish Gupta, Tengfei Miao, Adrien LaVoie, Douglas Walter Agnew | 2024-12-03 |
| 12020923 | Low-κ ALD gap-fill methods and material | Joseph R. Abel, Douglas Walter Agnew, Adrien LaVoie, Purushottam Kumar | 2024-06-25 |