Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174676 | Modular liquid cooling architecture for liquid cooling | Jerry Chiu, Reza H. Khiabani, Madhusudan K. Iyengar | 2024-12-24 |
| 11967538 | Three dimensional IC package with thermal enhancement | Woon-Seong Kwon, Madhusudan K. Iyengar, Teckgyu Kang | 2024-04-23 |
| 11955406 | Temperature control element utilized in device die packages | Yingying Wang, Emad Samadiani, Madhusudan K. Iyengar, Padam Jain, Teckgyu Kang +2 more | 2024-04-09 |