Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12138742 | Methods and apparatus for processing a substrate | Guan Huei See, Arvind Sundarrajan, Andrivo RUSYDI, Muhammad Avicenna Naradipa | 2024-11-12 |
| 12020992 | Methods and apparatus for processing a substrate | Guan Huei See, Arvind Sundarrajan, Muhammad Avicenna Naradipa, Andrivo RUSYDI | 2024-06-25 |
| 11931855 | Planarization methods for packaging substrates | Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prerna Goradia, Giback Park +3 more | 2024-03-19 |
| 11899376 | Methods for forming alignment marks | Liu Jiang, Marvin L. Bernt, El Mehdi Bazizi, Guan Huei See | 2024-02-13 |
| 11901225 | Diffusion layers in metal interconnects | Eric J. Bergman, John L. Klocke, Marvin L. Bernt | 2024-02-13 |