Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11987897 | Systems and methods for shielding features of a workpiece during electrochemical deposition | Eric J. Bergman, Jeffrey J. Dennison | 2024-05-21 |
| 11973034 | Nanotwin copper materials in semiconductor devices | Eric J. Bergman, John L. Klocke, Jing Xu, Kwan Wook Roh | 2024-04-30 |
| 11899376 | Methods for forming alignment marks | Prayudi Lianto, Liu Jiang, El Mehdi Bazizi, Guan Huei See | 2024-02-13 |
| 11901225 | Diffusion layers in metal interconnects | Eric J. Bergman, John L. Klocke, Prayudi Lianto | 2024-02-13 |
| 11875996 | Methods for electrochemical deposition of isolated seed layer areas | — | 2024-01-16 |