Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12146235 | Plating and deplating currents for material co-planarity in semiconductor plating processes | Paul R. McHugh, Charles Sharbono, Jing Xu, Sam Lee, Keith E. Ypma | 2024-11-19 |
| 12116686 | Parameter adjustment model for semiconductor processing chambers | Eric J. Bergman, Adam Marc McClure, Paul R. McHugh, Gregory J. Wilson | 2024-10-15 |
| 11982008 | Electroplating system | Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Paul Van Valkenburg, Eric J. Bergman +5 more | 2024-05-14 |
| 11973034 | Nanotwin copper materials in semiconductor devices | Eric J. Bergman, Marvin L. Bernt, Jing Xu, Kwan Wook Roh | 2024-04-30 |
| 11901225 | Diffusion layers in metal interconnects | Eric J. Bergman, Marvin L. Bernt, Prayudi Lianto | 2024-02-13 |