Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984358 | Systems and methods for improving within die co-planarity uniformity | Paul R. McHugh, Gregory J. Wilson | 2024-05-14 |
| 11973034 | Nanotwin copper materials in semiconductor devices | Eric J. Bergman, John L. Klocke, Marvin L. Bernt, Jing Xu | 2024-04-30 |