Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12155373 | Backend and acoustic process integration for high-Q filter | Kai Liu, Je-Hsiung Lan | 2024-11-26 |
| 12153466 | Support member supporting slidable display and electronic device including the same | — | 2024-11-26 |
| 12142561 | Integrated device and integrated passive device comprising magnetic material | Kai Liu, Je-Hsiung Lan | 2024-11-12 |
| 12046530 | Thermal bridge interposer structure | Je-Hsiung Lan, Ranadeep Dutta | 2024-07-23 |
| 12046545 | Hybrid reconstituted substrate for electronic packaging | Milind Shah, Periannan Chidambaram | 2024-07-23 |
| 12040268 | Thin film resistor (TFR) device structure for high performance radio frequency (RF) filter design | Je-Hsiung Lan, Kai Liu, Nosun PARK | 2024-07-16 |
| 12007808 | Foldable electronic device | Myeongsil PARK, Joohoon Lee, Seonghoon KIM | 2024-06-11 |
| 11984874 | Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods | Ranadeep Dutta, Je-Hsiung Lan | 2024-05-14 |
| 11960321 | Foldable electronic device comprising integrated-adhesive layer and adhesion prevention part | Seonghoon KIM, Sungho AHN, Kwangtai KIM, Donghyun YEOM | 2024-04-16 |
| 11894366 | Trench capacitor assembly for high capacitance density | Milind Shah, Periannan Chidambaram | 2024-02-06 |
| 11876085 | Package with a substrate comprising an embedded capacitor with side wall coupling | Abinash ROY, Lohith Kumar Vemula, Bharani Chava | 2024-01-16 |
| 11862367 | ESL-less AC resistor for high frequency applications | Sang-June Park, Je-Hsiung Lan, Ranadeep Dutta | 2024-01-02 |