Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935873 | Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips | Un-Byoung Kang, Sunkyoung Seo, Jongho Lee, Young Kun Jee | 2024-03-19 |
JJ
Joonho Jun
Overall (2024): #407,148 of 561,600Top 75%
1
Patents 2024