Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114453 | Core shell with various filler materials for enhanced thermal conductivity | William A. Counts, Andrew W. Meschke, Lei Gao, Abhijeet Misra, Alexander W. Williams +3 more | 2024-10-08 |
| 12070797 | Direct metal deposition of electronic device components | Anthony D. Prescenzi, Abhijeet Misra, Adam T. Clavelle, Eric W. Hamann, Isabel Yang +1 more | 2024-08-27 |
| 11985781 | Surface treatment for metallic components | Herng-Jeng Jou, Hoishun Li | 2024-05-14 |
| 11904391 | Additive manufacturing of articles comprising beryllium | — | 2024-02-20 |
| 11910552 | Electronic devices with corrosion-resistant colored metal structures | Manish Mittal, Brian S. Tryon, Jing Zhou, Matthew S. Rogers, Naoto Matsuyuki | 2024-02-20 |
| 11901585 | Nanotwin copper components | Hoishun Li, Herng-Jeng Jou, Wai Man Raymund Kwok, Zechariah D. Feinberg, Daniel C. Wagman +2 more | 2024-02-13 |