Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12000030 | Copper alloy film with high strength and high conductivity | Jacob L. Smith, Weiming Huang | 2024-06-04 |
| 11985781 | Surface treatment for metallic components | Hoishun Li, James A. Yurko | 2024-05-14 |
| 11901585 | Nanotwin copper components | Hoishun Li, James A. Yurko, Wai Man Raymund Kwok, Zechariah D. Feinberg, Daniel C. Wagman +2 more | 2024-02-13 |