Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114453 | Core shell with various filler materials for enhanced thermal conductivity | William A. Counts, Andrew W. Meschke, Lei Gao, Abhijeet Misra, Hoishun Li +3 more | 2024-10-08 |