Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114453 | Core shell with various filler materials for enhanced thermal conductivity | Andrew W. Meschke, Lei Gao, Abhijeet Misra, Alexander W. Williams, Hoishun Li +3 more | 2024-10-08 |
| 11898808 | Support plate thin cladding | Robert F. Meyer, Michael D. Quinones, Jason P. Shannon, David A. Pakula | 2024-02-13 |