Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923343 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2024-03-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923343 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2024-03-05 |