Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125759 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Isaac Rivera, Daniel S. Green | 2024-10-22 |
| 12099092 | Built in self-test of heterogeneous integrated radio frequency chiplets | Michael D. Hodge, Justin Kim, Daniel S. Green, Florian G. Herrault | 2024-09-24 |
| 11940495 | Built in self-test of heterogeneous integrated radio frequency chiplets | Michael D. Hodge, Justin Kim, Daniel S. Green, Florian G. Herrault | 2024-03-26 |
| 11914263 | Analog predistortion linearization for optical fiber communication links | Navid Hosseinzadeh, Aditya Jain, Roger Helkey | 2024-02-27 |