Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125759 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Isaac Rivera, James F. Buckwalter | 2024-10-22 |
| 12099092 | Built in self-test of heterogeneous integrated radio frequency chiplets | James F. Buckwalter, Michael D. Hodge, Justin Kim, Florian G. Herrault | 2024-09-24 |
| 11940495 | Built in self-test of heterogeneous integrated radio frequency chiplets | James F. Buckwalter, Michael D. Hodge, Justin Kim, Florian G. Herrault | 2024-03-26 |