Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125759 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Isaac Rivera, Daniel S. Green, James F. Buckwalter | 2024-10-22 |
| 12099092 | Built in self-test of heterogeneous integrated radio frequency chiplets | James F. Buckwalter, Michael D. Hodge, Justin Kim, Daniel S. Green | 2024-09-24 |
| 11972970 | Singulation process for chiplets | Joel C. Wong | 2024-04-30 |
| 11940495 | Built in self-test of heterogeneous integrated radio frequency chiplets | James F. Buckwalter, Michael D. Hodge, Justin Kim, Daniel S. Green | 2024-03-26 |