Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125759 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Daniel S. Green, James F. Buckwalter | 2024-10-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125759 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Daniel S. Green, James F. Buckwalter | 2024-10-22 |