Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12150264 | Electronic device including clad components | Abhijeet Misra, Todd S. Mintz, Isabel Yang, James A. Curran, Lei Gao +2 more | 2024-11-19 |
| 12114453 | Core shell with various filler materials for enhanced thermal conductivity | William A. Counts, Andrew W. Meschke, Lei Gao, Abhijeet Misra, Alexander W. Williams +3 more | 2024-10-08 |
| 12017275 | Additive manufacturing methods for components | Brian M. Gable | 2024-06-25 |
| 11985781 | Surface treatment for metallic components | Herng-Jeng Jou, James A. Yurko | 2024-05-14 |
| 11901585 | Nanotwin copper components | Herng-Jeng Jou, James A. Yurko, Wai Man Raymund Kwok, Zechariah D. Feinberg, Daniel C. Wagman +2 more | 2024-02-13 |