Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165956 | Molded silicon on passive package | Kumar Nagarajan, Karthik Shanmugam, Menglu Li, Raymundo M. Camenforte, Scott D. Morrison | 2024-12-10 |
| 12107283 | Cell packaging techniques | Angelo V. Marasco, Nathan J. Bohney, John M. McCambridge, Antonio Manenti, Laura Mayer +2 more | 2024-10-01 |
| 12074077 | Flexible package architecture concept in fanout | Karthik Shanmugam, Jun Zhai, Raymundo M. Camenforte, Menglu Li | 2024-08-27 |