Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113038 | Thermal compression flip chip bump for high performance and fine pitch | Hung-Yuan Hsu, Yangyang SUN, Wei Hu, Wei Wang, Lily Zhao | 2024-10-08 |
| 11948909 | Package comprising spacers between integrated devices | Yangyang SUN, Lily Zhao | 2024-04-02 |