Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113038 | Thermal compression flip chip bump for high performance and fine pitch | Dongming He, Hung-Yuan Hsu, Yangyang SUN, Wei Hu, Wei Wang | 2024-10-08 |
| 11948909 | Package comprising spacers between integrated devices | Yangyang SUN, Dongming He | 2024-04-02 |