Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113038 | Thermal compression flip chip bump for high performance and fine pitch | Dongming He, Yangyang SUN, Wei Hu, Wei Wang, Lily Zhao | 2024-10-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113038 | Thermal compression flip chip bump for high performance and fine pitch | Dongming He, Yangyang SUN, Wei Hu, Wei Wang, Lily Zhao | 2024-10-08 |