Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165341 | Optical resolution measurement method for optical devices | Jinxin FU, Ludovic Godet | 2024-12-10 |
| 12113038 | Thermal compression flip chip bump for high performance and fine pitch | Dongming He, Hung-Yuan Hsu, Wei Hu, Wei Wang, Lily Zhao | 2024-10-08 |
| 12019242 | Full-field metrology tool for waveguide combiners and meta-surfaces | Jinxin FU, Ludovic Godet | 2024-06-25 |
| 11988574 | Illumination system for AR metrology tool | Jinxin FU, Kazuya Daito, Ludovic Godet | 2024-05-21 |
| 11978196 | See-through metrology systems, apparatus, and methods for optical devices | Jinxin FU, Kazuya Daito, Ludovic Godet | 2024-05-07 |
| 11948909 | Package comprising spacers between integrated devices | Dongming He, Lily Zhao | 2024-04-02 |
| 11913776 | Interference in-sensitive Littrow system for optical device structure measurement | Jinxin FU, Ludovic Godet | 2024-02-27 |