Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955152 | Dielectric fill for tight pitch MRAM pillar array | Ashim Dutta, Chih-Chao Yang, Theodorus E. Standaert | 2024-04-09 |
| 11937514 | High-density memory devices using oxide gap fill | Theodorus E. Standaert, Chih-Chao Yang | 2024-03-19 |
| 11881433 | Advanced copper interconnects with hybrid microstructure | Chih-Chao Yang | 2024-01-23 |