Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087677 | Molded packaging for wide band gap semiconductor devices | Maria Clemens Y. Quinones, Jerome Teysseyre, Erwin Ian V. Almagro, Romel N. Manatad | 2024-09-10 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087677 | Molded packaging for wide band gap semiconductor devices | Maria Clemens Y. Quinones, Jerome Teysseyre, Erwin Ian V. Almagro, Romel N. Manatad | 2024-09-10 |