Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051647 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath | 2024-07-30 |
| 12046568 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Sujit Sharan, Jianyong Xie | 2024-07-23 |