Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12024590 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Yuki Kitai, Yasunori HOSHINO, Masashi Koda, Atsushi Wada | 2024-07-02 |
| 12022611 | Prepreg, metal-clad laminate, and wiring board | Yasunori HOSHINO, Yuki Kitai, Atsushi Wada, Masashi Koda | 2024-06-25 |
| 11967485 | Plasma processing apparatus and plasma processing method | Eiki KAMATA, Taro Ikeda, Nobuhiko Yamamoto | 2024-04-23 |
| 11901655 | Pin terminal, connector, wiring harness with connector and control unit | Akihiro Kato, Mitsuhiro Kumondai, Yoshifumi Saka | 2024-02-13 |
| 11887825 | Control method and plasma processing apparatus | Eiki KAMATA, Taro Ikeda | 2024-01-30 |
| 11866536 | Copper-clad laminate plate, resin-attached copper foil, and circuit board using same | Yuki Kitai, Masashi Koda, Yasunori HOSHINO, Atsushi Wada | 2024-01-09 |