Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12024590 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Mikio Sato, Yuki Kitai, Yasunori HOSHINO, Atsushi Wada | 2024-07-02 |
| 12022611 | Prepreg, metal-clad laminate, and wiring board | Yasunori HOSHINO, Yuki Kitai, Atsushi Wada, Mikio Sato | 2024-06-25 |
| 11958951 | Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board | Yuki Kitai, Atsushi Wada, Yasunori HOSHINO | 2024-04-16 |
| 11866536 | Copper-clad laminate plate, resin-attached copper foil, and circuit board using same | Yuki Kitai, Yasunori HOSHINO, Atsushi Wada, Mikio Sato | 2024-01-09 |