Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136591 | Through electrode substrate and semiconductor device | Satoru Kuramochi | 2024-11-05 |
| 12119293 | Through electrode substrate and mounting substrate | Shinji Maekawa, Hiroshi Kudo, Hiroshi Mawatari, Masaaki Asano | 2024-10-15 |
| 11862564 | Multi-layer line structure and method for manufacturing thereof | Hiroshi Kudo | 2024-01-02 |