Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119293 | Through electrode substrate and mounting substrate | Shinji Maekawa, Takamasa Takano, Hiroshi Mawatari, Masaaki Asano | 2024-10-15 |
| 11862564 | Multi-layer line structure and method for manufacturing thereof | Takamasa Takano | 2024-01-02 |