Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119293 | Through electrode substrate and mounting substrate | Shinji Maekawa, Hiroshi Kudo, Takamasa Takano, Masaaki Asano | 2024-10-15 |
| 12028972 | Wiring board and manufacturing method of the wiring board | Hiroki Furushou, Atsuko CHIGIRA, Toshio SASAO | 2024-07-02 |