Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183661 | Through electrode substrate and semiconductor device | — | 2024-12-31 |
| 12136591 | Through electrode substrate and semiconductor device | Takamasa Takano | 2024-11-05 |
| 12080637 | Through-hole electrode substrate | Sumio Koiwa, Hidenori Yoshioka | 2024-09-03 |