Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12124179 | Method of wafer alignment using at resolution metrology on product features | Wim Tjibbo Tel, Hermanus Adrianus DILLEN, Roy Werkman, Weitian Kou | 2024-10-22 |
| 11860548 | Method for characterizing a manufacturing process of semiconductor devices | Wim Tjibbo Tel, Hermanus Adrianus DILLEN, Mark John Maslow, Koen Thuijs, Peter David Engblom +3 more | 2024-01-02 |