SM

Stephen L. Morein

AT Adeia Semiconductor Bonding Technologies: 2 patents #13 of 25Top 55%
IN Intel: 1 patents #1,727 of 4,430Top 40%
Overall (2024): #65,409 of 561,600Top 15%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12170244 High-throughput additively manufactured power delivery vias and traces Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Henning Braunisch, Beomseok Choi +3 more 2024-12-17
12170268 Embedded metal lines 2024-12-17
11978724 Diffused bitline replacement in memory 2024-05-07