Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040312 | Semiconductor package structure and method for manufacturing the same | Chien-Wei Chang, Shang-Wei Yeh, Chung-Hsi Wu | 2024-07-16 |
| 11894340 | Package structure and method for manufacturing the same | Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai, Ching-Ju Chen | 2024-02-06 |