Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040261 | Substrate structure and method for manufacturing the same | Tsung-Tang Tsai, Huang-Hsien Chang, Ching-Ju Chen | 2024-07-16 |
| 11894340 | Package structure and method for manufacturing the same | Min-Lung Huang, Huang-Hsien Chang, Tsung-Tang Tsai, Ching-Ju Chen | 2024-02-06 |
| 11862585 | Semiconductor package structures and methods of manufacturing the same | Huang-Hsien Chang, Shu-Han Yang | 2024-01-02 |