Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040261 | Substrate structure and method for manufacturing the same | Syu-Tang Liu, Tsung-Tang Tsai, Ching-Ju Chen | 2024-07-16 |
| 11894340 | Package structure and method for manufacturing the same | Syu-Tang Liu, Min-Lung Huang, Tsung-Tang Tsai, Ching-Ju Chen | 2024-02-06 |
| 11886015 | Recessed portion in a substrate and method of forming the same | Shao Hsuan CHUANG | 2024-01-30 |
| 11862585 | Semiconductor package structures and methods of manufacturing the same | Syu-Tang Liu, Shu-Han Yang | 2024-01-02 |