Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040312 | Semiconductor package structure and method for manufacturing the same | Shang-Wei Yeh, Chung-Hsi Wu, Min-Lung Huang | 2024-07-16 |
| 11901183 | Fin field-effect transistor device and method of forming the same | Min-Hsiu Hung, Yi-Hsiang Chao, Hung-Yi Huang, Chih-Wei Chang | 2024-02-13 |